As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...
As system-on-chip (SoC) complexity grows, so does the necessity for products that seamlessly connect IP and streamline integration processes, minimize manual errors, and enhance productivity. The ...
Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...
In a new review article publication from Opto-Electronic Advances, Yingtao Hu, Di Liang and, Raymond G. Beausoleil from Hewlett Packard Labs discuss advanced III-V-on-silicon photonic integration.
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback