Video system design goes beyond evaluating and using the right microprocessors, peripheral chips and other related components. Consider that high-pin count, fine-pitch BGAs ranging upwards of 1,052 ...
The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.
Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...
Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
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