In-circuit test (ICT) has been instrumental in identifying manufacturing process defects and component defects on countless varieties of populated printed circuit board (PCB) assemblies for more than ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

As PCBs grow increasingly complex and lead-free solder technology dominates, test engineers will shift more attention to shorts and solder-joint integrity. Finding board shorts has become much more ...

For more than 40 years, ICT (in-circuit test) has been instrumental in identifying process defects on countless varieties of populated PCB (printed-circuit board) assemblies. An in-circuit tester ...

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern generation time for analogue circuit tests from months to just a matter of days ...

Siemens Digital Industries Software has introduced Tessent AnalogTest software -- an innovative solution that reduces pattern generation time for analog circuit tests from months to days. The solution ...