Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.
SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...
AI is driving demand and higher prices for DRAM and NAND into 2026. Products using non-volatile memories to replace NOR and ...
AmiCube] has announced their new PiStorm68K special edition MiniMig accelerator board. This board was developed to replace ...
As AI companies snap up memory chips, smartphone and PC makers face higher costs and tighter supply — which could lead to ...
Press Trust of India on MSN
Innodisk unveils the new AI on Dragonwing computing series with the first EXMP-Q911 COM-HPC mini module powered by Qualcomm's SoC
The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...
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