Engineers can now optimize FDM parts for real applications with reduced trial-and-error testing, allowing manufacturers to ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...

There’s always a strange joy in watching virtual money go up. Business simulation games have a special kind of magic. What ...

This video shows how to build an ATM machine from LEGO using standard LEGO bricks. The tutorial explains the complete construction process, including the outer casing, card slot design, button layout, ...

Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...

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