Engineers can now optimize FDM parts for real applications with reduced trial-and-error testing, allowing manufacturers to ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...

There’s always a strange joy in watching virtual money go up. Business simulation games have a special kind of magic. What ...